| 摘要 |
<p>A substrate processing apparatus (1) comprises a sponge that can absorb a processing solution and is capable of elastic deformation, a processing solution supply unit that supplies the processing solution to the sponge, a substrate holding unit that holds a substrate, and a contact unit that moves the sponge and a main surface of a substrate held in the substrate holding unit relative to each other, making the two come into contact with each other and thereby supplying the processing solution absorbed by the sponge to the main surface of the substrate. The sponge may include a total surface processing sponge (41) having a first substrate contact surface larger than the main surface of the substrate and a partial processing sponge (49) having a second substrate contact surface that is smaller than the main surface of the substrate. The substrate processing apparatus (1) may further include a contact control unit that makes either one of the sponges, the total surface processing sponge (41) and the partial processing sponge (49), and the main surface of the substrate held in the substrate holding unit come into contact by controlling the contact unit.</p> |
