| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a defect inspection method capable of improving accuracy of defect detection. <P>SOLUTION: After first defect inspection processing (step S11) for inspecting whether there is a defect on a wafer or not is performed, a defective chip is determined by the defect detected by the first defect inspection processing (steps S12, S13). Next, whether chips adjacent to the defective chip have defects or not is inspected excluding the defective chip with inspection sensitivity higher than that of the first defect inspection processing (step S16). <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
