发明名称 接合装置および接合方法
摘要 A pressure application technique is provided that enables two objects to be pressurized (e.g., objects to be bonded) to be positioned with greater accuracy before having pressure applied thereto. The objects to be pressurized are moved relative to each other in a Z direction such that the objects are brought into contact with each other (step S13). Then, a horizontal positional shift ”D between the objects to be pressurized is measured in the contact state of the objects to be pressurized (step S14). Thereafter, positioning of the objects to be pressurized is again performed by moving the objects to be pressurized relative to each other in the horizontal direction, as a result of which the positional shift ”D is corrected (step S17).
申请公布号 JP5732631(B2) 申请公布日期 2015.06.10
申请号 JP20090216985 申请日期 2009.09.18
申请人 ボンドテック株式会社 发明人 山内 朗
分类号 H01L21/60;H01L21/02 主分类号 H01L21/60
代理机构 代理人
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