| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component package which maintains airtightness in a package. <P>SOLUTION: A piezoelectric vibrator 1 of this invention is an electronic component package which encloses an electronic component 4 in a cavity 30 formed between multiple substrates which are joined to each other. In the piezoelectric vibrator 1, an inter-substrate wiring electrode 5 is hermetically formed in the base substrate 2 for creating electrical continuity between a bottom surface (external electrode 6) of the base substrate 2 and an upper surface (internal electrode 9) of the base substrate 2. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
