MICRO ELECTRO MECHANICAL SYSTEMS SENSOR MODULE PACKAGE AND THE METHOD OF MANUFACTURING THEREOF

摘要

The present invention relates to a micro electro mechanical systems (MEMS) sensor module package. According to an embodiment of the present invention, an MEMS sensor module package comprises: an MEMS sensor; a base part formed so as to encapsulate the MEMS sensor with a resin; an external terminal provided on one surface of the base part; a through mold via (TMV) provided in the base part to electrically connect the external terminal and the MEMS sensor; and an application specific integrated circuit (ASIC) stacked on the MEMS sensor. Therefore, a conventional printed circuit board is removed, and moreover, conventional wire bonding and plating and coating the outside are unnecessary, thereby reducing size to meet miniaturization required in a mobile apparatus. A sensor module package may be implemented within a size of the ASIC.