| 摘要 |
FIELD: technological processes.SUBSTANCE: invention relates to electronic devices containing one or more organic layers. A shaping method of an electronic device involves shaping on a carrying substrate of a variety of electronic-functional elements formed with a pile of layers, which contains the lower conducting layer, with that, the method involves a stage of shaping between the carrying substrate and the lower conducting layer of the non-conducting layer, which provides for increase of adhesion of the lower conducting layer to the carrying substrate, where the non-conducting layer includes a nitride layer containing less than 10 atomic percent of oxygen on the surface of boundary with the lower conducting layer.EFFECT: invention allows improving reliability of electronic devices.17 cl, 1 dwg |
