| 摘要 |
[Problem] Provided are a many-up wiring substrate that makes it possible to manufacture a wiring substrate where electronic components can be precisely mounted on the wiring substrate, a wiring substrate obtained therefrom, and an electronic device that can be precisely mounted on an external electric circuit board. [Solution] In a many-up wiring substrate including a base substrate (1) having dividing grooves formed as part of main surfaces thereof, along boundaries of a plurality of wiring substrate regions (1a), the plurality of wiring substrate regions (1a) being arranged in a matrix, when seen in a transparent plan view, dividing grooves (2) of one main surface and dividing grooves (3) of an opposite main surface are formed to be deviated in one direction of a transverse direction or longitudinal direction, and a distance (L1) between bottoms of the dividing grooves (2) of one main surface and bottoms of the dividing grooves (3) of the opposite main surface is smaller than a distance (L2) between the bottoms of the dividing grooves (2) of the one main surface and the opposite main surface and a distance (L3) between the bottoms of the dividing grooves (3) of the opposite main surface and the one main surface. Even if a burr is formed on a side, a wiring substrate (1e) can be obtained that can reduce protrusion of the burr to the outside further than the portion that is the bottom of the dividing groove (2) of one main surface. |
