发明名称 フラックスおよびソルダペースト
摘要 <p>The invention provides soldering flux for a soldering paste and the soldering paste. The soldering flux for the soldering paste inhibits leakage of the soldering flux during silk-screen printing, and does not cause bridging of the soldering paste using the soldering flux and deterioration of a printing shape. The soldering flux for the soldering paste in the invention is characterized by containing (a) matrix resin, (b) a solvent, (c) an activator and (d) a thickener, wherein the abovementioned thickener (d) contains an aliphatic ester of sugar.</p>
申请公布号 JP5731555(B2) 申请公布日期 2015.06.10
申请号 JP20130014887 申请日期 2013.01.29
申请人 发明人
分类号 B23K35/363 主分类号 B23K35/363
代理机构 代理人
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