| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a design device capable of providing a highly reliable semiconductor integrated circuit in which the temperature difference within a chip is small. <P>SOLUTION: A thermal analysis unit 11 performs a thermal analysis on the basis of data for a semiconductor integrated circuit to design, and calculates a temperature distribution. A vector generation unit 12 generates a vector in accordance with a temperature gradient in the calculated temperature distribution. A dummy pattern generation unit 13 generates a dummy pattern in accordance with the generated vector, and adds the dummy pattern to layout data for the semiconductor integrated circuit. By generating such a dummy pattern, the temperature distribution is averaged, and a highly reliable semiconductor integrated circuit in which the temperature difference within a chip is small can be provided. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
