| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method and an apparatus for three-dimensional positioning of a fine diameter wire bond, which can quickly and accurately perform three-dimensional positioning of the wire bond prior to quality inspection of a bonding state of the wire bond. <P>SOLUTION: In the method for performing the three-dimensional positioning of a wire bond 1 set on a movable stage 2 by using a camera 5 and line lasers 3, 4, the line lasers 3, 4 are arranged with an angle from the direction of the camera 5 so that an applied laser line is not aligned to other irradiation portions in a wire bond irradiation part, and in image data of the wire bond 1 inputted by the camera 5 and irradiated with the laser line, movement of the movable stage 2 is controlled based on a numerical value found out by operation from a deviation between a position of the laser line on the wire bond 1 and a reference position and an inclination angle of the line lasers. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
