| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor ultraviolet light receiving element having a novel structure, which suppresses separation of a metal electrode for wiring-bonding from an organic electrode. <P>SOLUTION: A semiconductor ultraviolet light receiving element comprises a semiconductor layer 3 formed of a group II oxide semiconductor or a group III nitride semiconductor; an ultraviolet-transmitting organic electrode 5 formed on the semiconductor layer 3; an insulating layer formed outside of the organic electrode 5 on the semiconductor layer 3; and a metal electrode 6 for wiring-bonding extending from the organic electrode to the insulating layer and ensuring a bonding region above the insulating layer. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
