| 发明名称 |
ADHESION METHOD USING THIN ADHESIVE LAYERS |
| 摘要 |
<p>The invention relates to a method for adhering flexible substrates, the connecting adhesive layer being formed in a thin manner. The invention further relates to a composite substrate, wherein the two substrates are connected by a thin flexible adhesive layer.</p> |
| 申请公布号 |
EP2880084(A1) |
申请公布日期 |
2015.06.10 |
| 申请号 |
EP20130740274 |
申请日期 |
2013.07.23 |
| 申请人 |
HENKEL AG&CO. KGAA |
发明人 |
KINZELMANN, HANS-GEORG;GIERLINGS, MICHAEL |
| 分类号 |
C08J5/12;B32B7/12;B32B27/12;B32B27/32;B32B27/36;B32B37/04 |
主分类号 |
C08J5/12 |
| 代理机构 |
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