| 摘要 |
<p>The method of manufacturing a coil for a camera module driving unit with a shaking correction OIS and an auto-focusing function comprises: a first step of forming the lowest layer under bump metallurgy (UBM) on a substrate; a second step of forming a coil pattern on the lowest layer UBM by using photoresist; a third step of depositing a coil on the coil pattern; a fourth step of etching the lowest layer UBM and removing the photoresist on the lowest layer UBM; and a fifth step of forming a protective layer on the coil, forming an insulation layer on the protective layer, and forming via holes, which pass through a part of the insulation layer on the protective layer to be connected to the upper coil part of the insulation layer. From the first step to fifth step are repeatedly performed on the insulation layer to stack at least two coil parts, the top layer UBM, and a bump are formed on the via holes formed in the coil of the top layer coil part, and the bump is reflowed. The OIS actuator can be minimized, and a hall sensor-embeded coil can be obtained by forming a hall sensor device on the substrate.</p> |
