| 摘要 |
<p>The present invention prevents foreign substances such as dust from being flowed into an empty space (E) and improves an assembling strength between a cylindrical plunger and a combination unit of an upper probe member by filling the empty space between the cylindrical plunger and the combination unit with a bonding material using solder paste when the combination unit of the upper probe member having a plate structure in a polygonal shape such as a rectangular parallelepiped is inserted into the cylindrical plunger which is hollowed. Moreover, a reliable test of a semiconductor device can be processed by using the upper probe member having the plate structure in a polygonal shape capable of increasing the contact reliability between the semiconductor device and a probe member for a pogo pin, and a rapid and accurate test of the semiconductor device can be processed in comparison with a traditional pogo pin structure thanks to the prevention of the inflow of the foreign substances and the increase of the assembling strength. The pogo pin structure comprises the upper probe member, a lower probe member, an elastic member, and the cylindrical plunger.</p> |
