| 摘要 |
PROBLEM TO BE SOLVED: To provide a light emitting device that achieves sufficient electric insulation and is inexpensively manufactured through easy manufacturing processes.SOLUTION: In a light emitting device 1 which has a emitting light part 2, a region surrounding the light emitting part on an insulating substrate 3 with a high thermal conductivity, and a positive electrode external connection land 12 and a negative electrode external connection land 13 provided on the insulating substrate in the region surrounding the light emitting part, a plurality of wiring patterns is directly formed on the insulating substrate, the wiring patterns comprises a wiring pattern for anode electrically connected to the positive electrode external connection land and a wiring pattern for cathode electrically connected to the negative electrode external connection land. In the light emitting part, a plurality of semiconductor light emitting element is adhered to the insulating substrate, and are sealed by a sealing body, the semiconductor light emitting is a semiconductor LED chip, and the positive electrode external connection land and the negative electrode external connection land are provided opposite each other so as to interleave the light emitting part. |
