发明名称 半導体ウェハ処理用減圧処理容器
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a decompression processing container which has superior heat resistance, high intensity, and low heat capacity and can easily be carried. <P>SOLUTION: A thin inner container 11 formed in a cylindrical shape by stainless steel and a thin outer container 17a which forms a vacuum insulation space 13 between the inner container 11 and the outer container, is formed in the cylindrical shape by the stainless steel, and in which a plurality of rib-like undulations 15 are formed on an outer peripheral face are bonded, and a dual structure is obtained. The structure uses a base plate 19 of a metallic material, especially the stainless steel, whose thickness is made to be not more than that of the inner container 11, which absorbs an interval change between the inner container 11 and the outer container 17a and has a U-shaped cross section, for example. The container has the low heat capacity, the superior heat resistance, and the high intensity. <P>COPYRIGHT: (C)2013,JPO&INPIT</p>
申请公布号 JP5731270(B2) 申请公布日期 2015.06.10
申请号 JP20110102823 申请日期 2011.05.02
申请人 发明人
分类号 H01L21/31;C23C16/44;C23C16/46 主分类号 H01L21/31
代理机构 代理人
主权项
地址
您可能感兴趣的专利