<p>A multi-chip push-pull magnetoresistive bridge sensor utilizing magnetic tunnel junctions is disclosed. The magnetoresistive bridge sensor is composed of a two or more magnetic tunnel junction sensor chips placed in a semiconductor package. For each sensing axis parallel to the surface of the semiconductor package, the sensor chips are aligned with their reference directions in opposition to each other. The sensor chips are then interconnected as a push-pull half-bridge or Wheatstone bridge using wire bonding. The chips are wire-bonded to any of various standard semiconductor lead frames and packaged in inexpensive standard semiconductor packages.</p>
申请公布号
EP2682771(A4)
申请公布日期
2015.06.10
申请号
EP20120751762
申请日期
2012.03.02
申请人
JIANGSU MULTIDIMENSION TECHNOLOGY CO. LTD
发明人
DEAK, JAMES GEZA;JIN, INSIK;SHEN, WEIFENG;XUE, SONGSHENG;LEI, XIAOFENG;ZHANG, XIAOJUN;LI, DONGFENG