发明名称 |
Trench capacitor with spacer-less fabrication process |
摘要 |
A trench capacitor and method of fabrication are disclosed. The SOI region is doped such that a selective isotropic etch used for trench widening does not cause appreciable pullback of the SOI region, and no spacers are needed in the upper portion of the trench. |
申请公布号 |
US9053956(B2) |
申请公布日期 |
2015.06.09 |
申请号 |
US201313800488 |
申请日期 |
2013.03.13 |
申请人 |
International Business Machines Corporation |
发明人 |
Pei Chengwen;Li Xi;Wang Geng |
分类号 |
H01L27/108;H01L29/76;H01L29/06;H01L21/308;H01L29/66;H01L29/94;H01L21/84;H01L27/12 |
主分类号 |
H01L27/108 |
代理机构 |
|
代理人 |
Abate Joseph P.;Cohn Howard H. |
主权项 |
1. A semiconductor structure comprising:
a substrate; an insulator layer disposed on the substrate; a silicon-on-insulator layer disposed on the insulator layer; a trench formed in the substrate, wherein an upper portion of the trench traverses the insulator layer and silicon-on-insulator layer, and a lower portion of the trench is formed within the substrate, and wherein the upper portion has a first width and the lower portion has a second width, and wherein the second width is greater than the first width; and wherein the silicon-on-insulator layer comprises a trench contact region that forms a portion of an interior surface of upper portion of the trench, and wherein a conductive plug is disposed in the trench and wherein the conductive plug is in direct physical contact with the trench contact region of the silicon-on-insulator layer. |
地址 |
Armonk NY US |