发明名称 Heat-resistant polyamide composition and application thereof
摘要 The present invention discloses a heat-resistant polyamide composition and application thereof. The composition comprises the following components in percentage by weight: 40% to 90% of heat-resistant polyamide resin, 5% to 35% of mineral fiber A, 0 to 35% of mineral filler B, 0.1% to 1% of light stabilizer, 0.1% to 1% of flow modifier and 0.1% to 1% of antioxidant. In the present invention, heat-resistant polyamide resin with the ratio of amine-terminated group and carboxyl-terminated group between 0.1 and 0.8 is selected to be matched with deformed glass fibers with an aspect ratio of 2 to 6, the mineral filler B and the flow modifier to obtain the heat-resistant polyamide composition. The heat-resistant polyamide composition not only has high initial whiteness, high reflectivity and excellent heat resistance, but also has good moldability and good dimensional stability; therefore, the heat-resistant polyamide composition is capable of being applied for preparing the reflecting supports for such light sources as LCD backlight of portable phones, computers, televisions and the like, as well as headlights of automotive vehicles, instrument panels and lighting appliances, etc.
申请公布号 US9051454(B2) 申请公布日期 2015.06.09
申请号 US201114351127 申请日期 2011.12.08
申请人 KINGFA SCI & TECH CO. LTD.;SHANGHAI KINGFA TECHNOLOGY DEVELOPMENT CO., LTD 发明人 Yi Qingfeng;Jiang Sujun;Mai Jiehong;Jiang Zhingqiang;Long Jieming;Yan Xia;Ning Kaijun;Cai Tongmin
分类号 C08K3/00;C08K3/02;C08K3/18;C08K3/22;C08K3/26;C08K3/40;C08K5/00;C08K5/04;C08K5/07;C08K5/13;C08K5/36;C08K5/52;C08K13/04;C08L77/06;H01L33/60 主分类号 C08K3/00
代理机构 Lucas & Mercanti, LLP 代理人 Lucas & Mercanti, LLP ;Phillips Peter J.
主权项 1. A heat-resistant polyamide composition, which is characterized by comprising the following components in percentage by weight: 40% to 90% of heat-resisting polyamide resin, 5% to 35% of mineral fiber A, 14.2 to 35% of mineral filler B, 0.1% to 1% of light stabilizer, 0.1% to 1% of flow modifier, and 0.1% to 1% of antioxidant, wherein the heat-resistant polyamide resin comprises a dicarboxylic acid component unit a and a diamine component unit b, the dicarboxylic acid component a comprises aromatic dicarboxylic acids, and the content of the dicarboxylic acids component in the heat-resistant polyamide resin is more than 25 mol %; the diamine component b comprises a linear aliphatic diamine component with carbon numbers of 4 to 20 and/or an aliphatic diamine component with branched chain and/or an alicyclic diamine component; and the ratio of amine-terminated group and carboxyl-terminated group is controlled between 0.1 and 0.8.
地址 CN