发明名称 Hot press device and multi-layered printed board press method
摘要 A hot press device manufacturing a multilayered printed board by pressing processed members laminated by mutually opposing heating plates includes: a plurality of heating plates including a plurality of projected parts and punched parts engaging therewith and capable of moving in a direction in which the processed members are laminated; and a pressure mechanism pressurizing each of the heating plates in the lamination direction, wherein the processed member is arranged between the heating plates and is pressed by the heating plates pressurized by the pressure mechanism while engaged with each other.
申请公布号 US9055704(B2) 申请公布日期 2015.06.09
申请号 US201113329589 申请日期 2011.12.19
申请人 Hitachi, Ltd. 发明人 Kose Kouji;Togawa Kouta;Kawazoe Katsuro;Kojima Takayoshi
分类号 B30B7/02;H05K3/46 主分类号 B30B7/02
代理机构 Volpe and Koenig, P.C. 代理人 Volpe and Koenig, P.C.
主权项 1. A hot press device manufacturing a multilayered printed board by pressing processed members laminated by mutually opposing heating plates, the hot press device comprising: a plurality of heating plates capable of moving in a direction in which the processed members are laminated; wherein a heating plate guide pin consisting essentially of a projected part and a heating guide bush consisting essentially of a through hole are independently coupled to the sides of each heating plate at a different position, a pressure mechanism pressurizing each of the heating plates in the lamination direction, wherein the opposing heating plates are positioned with the projected part of the heating plate guide pin and the through hole of the heating plate guide bush engaging therewith, and wherein the processed member is arranged between the heating plates and is pressed by the heating plates pressurized by the pressure mechanism while engaged with each other.
地址 Tokyo JP