Method of fabricating a multi-piece board

摘要

A fabrication method for a multi-piece board includes: checking whether pieces (printed wiring boards) are defect-free or not; forming a first recess in a joint portion between a defective piece and a frame; forming a first fitting portion at the frame by separating the defective piece; cutting out a defect-free piece having a second fitting portion from another board; forming a second recess in the second fitting portion; fitting the second fitting portion into the first fitting portion; flattening a joint portion; and filling an adhesive in a third recess which is formed by the first recess and the second recess, and curing the adhesive to adhere the frame and the defect-free piece.

主权项

1. A fabrication method for a multi-piece board, comprising:
forming a first recess in a joint portion connecting a defective piece and a frame of a first board; separating the defective piece from the frame such that a first fitting portion having the first recess is formed in the frame of the first board; forming a second recess in a joint portion connecting a defect-free piece and a frame of a second board; cutting out the defect-free piece from the frame of the second board such that the defect-free piece having a second fitting portion including the second recess is separated from the second board; positioning the defect-free piece to the frame of the first board such that the second fitting portion of the defect-free piece fits in the first fitting portion in the frame of the first board and that the second recess of the defect-free piece and the first recess in the frame of the first board form a third recess; filling an adhesive material in the third recess formed of the first recess and the second recess; and adhering the frame of the first board and the defect-free piece, wherein the defective piece comprises a printed wiring board, and the defect-free piece comprises a printed wiring board.