THERMAL CONDUCTIVE HYBRID COMPOSITE AND PREPARATION METHODS THEREOF

摘要

In the present invention, provided is a polymer composite, including a heat-resistant resin; 45-64 wt% of polyimide particles whose surface is treated to improve interfacial adhesive; and a thermal conductive filler. The polymer composite according to the present invention has excellent thermal conduction by dispersing polyimide particles whose surface is treated by the heat-resistant resin, and accordingly locating the thermal conductive filler in the inner space of a polymer matrix which is excluded by the dispersed polyimide particle. In addition, the polymer composite can ensure high thermal conduction by increasing surface areas of the filler with use of the peeled thermal conductive filler even if a small amount of the filler is introduced, thereby reducing a use amount of a heavyweight and high-priced thermal conductive filler and leading weight lightening and reduction of costs. Therefore, the polymer composite can be used for manufacturing heat insulating boards, heat radiation sheets, etc. required in electronic component industry, semi-conductor industry, etc.