发明名称 |
Chip package structure and manufacturing method thereof |
摘要 |
An embodiment of the present invention provides a manufacturing method of a chip package structure including: providing a first substrate having a plurality of predetermined scribe lines defined thereon, wherein the predetermined scribe lines define a plurality of device regions; bonding a second substrate to the first substrate, wherein a spacing layer is disposed therebetween and has a plurality of chip support rings located in the device regions respectively and a cutting support structure located on peripheries of the chip support rings, and the spacing layer has a gap pattern separating the cutting support structure from the chip support rings; and cutting the first substrate and the second substrate to form a plurality of chip packages. Another embodiment of the present invention provides a chip package structure. |
申请公布号 |
US9054114(B2) |
申请公布日期 |
2015.06.09 |
申请号 |
US201414290638 |
申请日期 |
2014.05.29 |
申请人 |
XINTEC INC. |
发明人 |
Lee Hung-Jen;Chang Shu-Ming;Chiang Chen-Han;Liu Tsang-Yu;Ho Yen-Shih |
分类号 |
H01L23/544;H01L21/56;H01L23/16;H01L23/31;H01L23/00;H01L21/683;H01L23/498 |
主分类号 |
H01L23/544 |
代理机构 |
Liu & Liu |
代理人 |
Liu & Liu |
主权项 |
1. A chip package structure, comprising:
a first substrate comprising a micro electro-mechanical system chip; a second substrate comprising an application specific integrated circuit chip and disposed on the first substrate; and a spacing layer disposed between the first substrate and the second substrate to separate the first substrate from the second substrate, wherein the spacing layer has a chip support ring and an outer wall structure located on a periphery of the chip support ring, and the chip support ring and the outer wall structure are separated from each other by a gap therebetween. |
地址 |
Taoyuan TW |