发明名称 Ultrasound endoscope
摘要 A wiring board electrically connected to a back side of an ultrasound transmitting/receiving section that transmits/receives ultrasound includes a rigid circuit board included in a stiff portion, and a wrapping portion extending out from the rigid circuit board (stiff portion), and a plurality of drive wirings electrically connected to the wiring board are inserted into a wiring insertion portion of a housing with the plurality of drive wirings wrapped and bundled by the wrapping portion.
申请公布号 US9050052(B2) 申请公布日期 2015.06.09
申请号 US201313965414 申请日期 2013.08.13
申请人 OLYMPUS MEDICAL SYSTEMS CORP. 发明人 Irie Kei
分类号 A61B8/14;A61B8/00;A61B8/12 主分类号 A61B8/14
代理机构 Scully, Scott, Murphy & Presser, P.C. 代理人 Scully, Scott, Murphy & Presser, P.C.
主权项 1. An ultrasound endoscope comprising: an ultrasound transducer configured to transmit and/or receive ultrasound; a first drive wiring having a first portion and a second portion extending away from the first portion of the first drive wiring; a main circuit board comprising: a board material; anda first main circuit pattern provided on the board material, wherein the first main circuit pattern electrically connects the ultrasound transducer and the first portion of the first drive wiring; a first flexible sheet material attached to the main circuit board, the first flexible sheet material comprising: a first protection portion arranged to extend away from the main circuit board and to cover the first portion of the first drive wiring; anda first wrapping portion arranged to extend away from the first protection portion and to cover the second portion of the first drive wiring; and a housing comprising: a main circuit board housing portion configured to house the main circuit board, the first portion of the first drive wiring and the first protection portion of the first flexible sheet material; anda tubular drive wiring insertion portion extending away from the main circuit board housing portion, wherein the tubular drive wiring insertion portion is configured to house the first wrapping portion of the first flexible sheet material and the second portion of the first drive wiring.
地址 Tokyo JP