Silicon shaping

摘要

One embodiment for forming a shaped substrate for an electronic device can form a shaped perimeter to define the substrate shape on the surface of a substrate. The shaped perimeter can extend at least part way into the substrate. A subsequent thinning process can remove substrate material and expose the shaped perimeter effectively forming shaped dies from the substrate.

主权项

1. A method for forming a shaped die from a substrate, the substrate including at least one circuit element, the method comprising:
forming a trench partially extending through a thickness of the substrate, the trench defining a first edge of the shaped die and a second edge the shaped die opposite the first edge, wherein a terminal end of the trench includes an elongated cavity that chamfers the second edge; attaching a handle to the substrate; thinning the substrate such that the trench extends all the way through the thickness of the substrate; and separating the shaped die from a remaining portion of the substrate by removing the handle.