Method and device for producing a microlens

摘要

This invention relates to a method for producing a microlens with a carrier wafer, in which a lens in one opening of the carrier wafer is molded into the carrier wafer by stamping of the lens and to a corresponding device for executing the method and to a microlens which has been produced using the method. Furthermore the invention relates to a device for producing a microlens as well as a microlens.

主权项

1. Method for producing a microlens with a carrier wafer, the carrier wafer having an inner ring extending between opposite facing surfaces of the carrier wafer, the inner ring defining an opening of the carrier wafer for accommodating the microlens therein, wherein a holding structure extends from an annular surface of the inner ring at a location spaced from both of the opposite facing surfaces of the carrier wafer, the method comprising a step of:
molding the microlens into the carrier wafer by stamping of the microlens using two lens dies each having a contact surface dimensioned to adjoin a corresponding mating surface of the carrier wafer for coplanar alignment of the lens dies during stamping, and wherein the holding structure projects into an outer peripheral portion of the microlens for positive fixing of the microlens to the inner ring of the carrier wafer such that the microlens is fixed to the holding structure and wherein the carrier wafer and the microlens form a positive connection that cannot be nondestructively broken.