Wafer prober integrated with full-wafer contactor

摘要

Methods and apparatus for testing unsingulated integrated circuits on a wafer include adapting a wafer prober for use with full-wafer-contacter disposed on the wafer. Some embodiments include placing wafer on a chuck of the prober, aligning the wafer to a full-wafer contacter incorporated in the wafer prober, removably attaching the wafer to the full wafer contacter, separating the wafer from the chuck, and making electrical contact to one or more integrated circuits of the wafer by making physical contact with a surface of the full-wafer contacter that faces away from the wafer.

主权项

1. An apparatus for coupling a plurality of electrical pathways to a wafer, comprising:
a wafer translator having a wafer-side positioned to face a wafer and an inquiry-side facing away from the wafer-side, wherein the wafer translator has a first plurality of first scale contact pads at the wafer-side corresponding to contacts on the wafer, and a second plurality of second scale contact pads at the inquiry-side corresponding to contacts of a probe card, wherein the first scale is generally smaller than the second scale, wherein the wafer translator is monolithic between the wafer-side and the inquiry-side, and wherein the wafer translator is mechanically coupled to a mounting fixture; a gasket positioned to seal a space between the wafer translator and the wafer; and a source of vacuum connected with the space between the wafer translator and the wafer.