Polyamic acid resin composition and method for forming polyimide resin

摘要

Additives of a polyamic acid resin composition are disclosed, including an ester-phenol compound, an imidazole compound, and a heterocyclic aromatic amine compound other than the imidazole compound. The high cyclization temperature and long cyclization period of conventional polyamic acid resin compositions can be lowered and shorten by the additives of the invention. In addition, a metal foil and the polyimide resin formed from the cyclization have excellent adhesive strength, high flat degree, and excellent electrical property.

主权项

1. A polyamic acid resin composition, comprising:
a polyamic acid resin; and an additive, wherein the polyamic acid resin and the additive have a molar ratio of 1:0.1 to 1:0.5, wherein the additive comprises: an ester-phenol compound; an imidazole compound; and a heterocyclic aromatic amine compound other than the imidazole compound; wherein the ester-phenol compound is benzyl 4-hydroxybenzoate, methyl 4-hydroxybenzoate, or combinations thereof; wherein the imidazole compound is imidazole, benzimidazole, or combinations thereof; and wherein the heterocyclic aromatic amine compound is 4,4′-dipyridyl, 1, 10-phenanthroline, or combinations thereof; wherein the polyamic acid resin and the ester-phenol compound have a molar ratio of 1:0.01 to 1:0.1; wherein the polyamic acid resin and the imidazole compound have a molar ratio of 1:0.06 to 1:0.3; and wherein the polyamic acid resin and the heterocyclic aromatic amine compound have a molar ratio of 1:0.03 to 1:0.1.