Reflective optical sensor and image forming device incorporating the same

摘要

A reflective optical sensor includes a light emitting element to irradiate a target object with a light beam, a light receiving element to receive the light beam reflected by the surface of the target object, a circuit board on which the light emitting element and light receiving element are mounted, a cover element supported on the circuit board to surround the light emitting element and light receiving element, and a light shielding wall provided in the cover element to be a partition between the light emitting element and light receiving element to prevent a part of the light beam from the light emitting element from leaking to the light receiving element. A layer in a certain thickness is formed on the surface of the circuit board along either or both sides of the light shielding wall.

主权项

1. A reflective optical sensor comprising:
a light emitting element to irradiate a target object with a light beam; a light receiving element to receive the light beam reflected by a surface of the target object; a circuit board comprising a base, a wiring pattern disposed on the base, and a resist layer provided on a surface of the wiring pattern, on which the light emitting element and light receiving element are mounted, wherein the light emitting element is disposed on the circuit board to irradiate the light beam in a light emitting direction that is parallel to the circuit board; a cover element supported on the circuit board to surround the light emitting element and light receiving element; a light shielding wall provided in the cover element to be a partition between the light emitting element and light receiving element, and positioned to contact a surface of the circuit board at one end or not to contact the surface at one end with a minute gap, to prevent a part of the light beam from the light emitting element from leaking to the light receiving element, the one end being an end close to the circuit board; and a layer in a certain thickness formed on the surface of the circuit board along either or both sides of the light shielding wall.