Flip chip overmold package

摘要

An integrated circuit (IC) package having a packaging substrate, an IC disposed onto the packaging substrate, and a rigid support member attached to the substrate layer through an adhesive spacer is provided. The packaging substrate includes multiple decoupling capacitors positioned thereon around the IC. A heat sink is placed over the IC. The rigid support member provides enhanced structural support for the IC packaging and there is ample space between a bottom surface of the rigid support member and the packaging substrate to allow the placement of the decoupling capacitors underneath the rigid support member.

主权项

1. A method of packaging an integrated circuit (IC), comprising:
placing the IC onto a packaging substrate; disposing a plurality of decoupling capacitors onto the packaging substrate outside a perimeter of the IC; affixing a rigid support member to the packaging substrate with an adhesive spacer, the adhesive spacer elevating the rigid support member to enable the decoupling capacitors to be disposed onto the packaging substrate underneath the support member, the IC extending above and below the rigid support member, the rigid support member configured to establish a spacing between an entirety of the rigid support member and an entirety of an overlying heatsink; and injecting a molding compound around the perimeter of the IC.