Method for integrating an electronic component into a printed circuit board

摘要

A method for integrating a component into a printed circuit board includes the following steps: providing two completed printed circuit board elements, which more particularly consist of a plurality of interconnected plies or layers, wherein at least one printed circuit board element has a cutout or depression, arranging the component to be integrated on one of the printed circuit board elements or in the cutout of the at least one printed circuit board element, and connecting the printed circuit board elements with the component being accommodated in the cutout, as a result of which it is possible to obtain secure and reliable accommodation of a component or sensor in a printed circuit board. Furthermore, a printed circuit board of this type comprising an electronic component integrated therein is provided.

主权项

1. A method for integrating an electronic component into a printed circuit board, comprising the following the steps of:
providing two completed printed circuit board elements, which more particularly consist of a plurality of interconnected layers or plies, wherein at least one of the printed circuit board elements comprises a cutout or depression; arranging the component to be integrated on one of the printed circuit board elements or in the cutout of the at least one of the printed circuit board element; and connecting the printed circuit board elements with the component being accommodated in the cutout, wherein evaluation electronics for the component is integrated in the printed circuit board, that the electronic component, in its state accommodated in the cutout, is shielded from the external environment of the two printed circuit board elements and/or neighboring regions of the printed circuit board elements and that, in the region of contact connections of the component to be integrated, a layer of a hermetically tight, non-conducting material is embedded in a printed circuit board element and a contact connection of the component is realized by blind holes formed through the hermetically sealing layer and filled with a conductive material or a plating.