Probe card and manufacturing method thereof

摘要

In one embodiment, a probe card is provided. The probe card includes: a substrate having a first surface and a second surface opposite to the first surface; a through hole formed through the substrate and extending between the first surface and the second surface; an elastic member formed in the through hole to extend to the first surface; a through electrode formed in through hole to extend to the second surface; a first trace on a surface of the elastic member to be electrically connected to the through electrode; and a contact bump on the elastic member via the first trace to be electrically connected to the first trace, wherein the contact bump is electrically connected to an electrode pad formed on a DUT (device under test) when an electrical testing is performed on the DUT using the probe card.

主权项

1. A probe card, comprising:
a substrate having a first surface and a second surface opposite to the first surface; a through hole formed through the substrate and extending between the first surface and the second surface; an elastic member formed in the through hole to extend to the first surface of the substrate and having a first surface and a second surface opposite to the first surface, wherein the first surface of the elastic member is located and exposed on a side of the first surface of the substrate, and the second surface of the elastic member is located at an intermediate position, in a thickness direction of the substrate, in the through hole; a through electrode formed in the through hole to extend to the second surface of the substrate and having a first end surface and a second end surface, wherein the first end surface of the through electrode is located on the second surface side of the elastic member, and the second end surface of the through electrode is exposed on a side of the second surface of the substrate; a trace formed to extend from the second surface of the elastic member to the first surface of the elastic member, wherein the trace is electrically connected to the through electrode on the second surface of the elastic member, the trace comprises a first trace and a second trace, one end portion of the first trace is in contact with the second surface of the elastic member and is electrically connected to the first end surface of the through electrode, the first trace extends along an inner surface of the through hole, the other end portion of the first trace is located on the first surface of the substrate, one end portion of the second trace is electrically connected to the other end portion of the first trace, and the other end portion of the second trace is located on the first surface of the elastic member; and a contact bump electrically connected to the other end portion of the second trace above the first surface of the elastic member, wherein the contact bump is electrically connected to an electrode pad formed on a DUT (device under test) when an electrical testing is performed on the DUT using the probe card.