发明名称 Patterning of vertical nanowire transistor channel and gate with directed self assembly
摘要 Directed self-assembly (DSA) material, or di-block co-polymer, to pattern features that ultimately define a channel region a gate electrode of a vertical nanowire transistor, potentially based on one lithographic operation. In embodiments, DSA material is confined within a guide opening patterned using convention lithography. In embodiments, channel regions and gate electrode materials are aligned to edges of segregated regions within the DSA material.
申请公布号 US9054215(B2) 申请公布日期 2015.06.09
申请号 US201213719113 申请日期 2012.12.18
申请人 Intel Corporation 发明人 Nyhus Paul A.;Sivakumar Swaminathan
分类号 H01L21/8234;H01L29/78;H01L29/775;H01L29/66;B82Y10/00;B82Y40/00;H01L29/423;H01L29/06;H01L29/16 主分类号 H01L21/8234
代理机构 Blakely, Sokoloff, Taylor & Zafman LLP 代理人 Blakely, Sokoloff, Taylor & Zafman LLP
主权项 1. A method of forming a nanowire transistor on a substrate, the method comprising: lithographically patterning a guide opening of a first diameter in a mask layer disposed over a source/drain semiconductor layer of the transistor; depositing a directed self-assembly (DSA) material into the guide opening; segregating the DSA material into an interior polymer region completely surrounded by an exterior polymer region within the guide opening by baking and/or curing; defining a semiconductor channel region of the transistor within the guide opening by removing one of the interior and exterior polymer regions selectively to the other, wherein the channel region diameter and spacing from an edge of the guide opening are both defined by the DSA segregation; removing the other of the interior and exterior polymer regions; depositing a gate dielectric over the semiconductor channel region; and surrounding the semiconductor channel region with an annular gate electrode having an outer diameter self-aligned to the guide opening.
地址 Santa Clara CA US