MEMS switches and other miniaturized devices having encapsulating enclosures, and processes for fabricating same

摘要

Miniaturized devices such as MEMS switches (10) have encapsulating enclosures (100). The enclosure (100) and the remainder of the switch (10) are fabricated on a concurrent basis by depositing layers of an electrically-conductive material, such as copper, on a substrate (26).

主权项

1. A miniaturized switch, comprising:
a substrate having a ground plane disposed thereon; an electrically-conductive housing disposed on the ground plane so as to define a channel entirely surrounded by a conductive material; a first electrical conductor suspended within the channel by first electrically-insulative supports bridging a gap between the first electrical conductor and the electrically-conductive housing; a second electrical conductor suspended within the channel by second electrically-insulative supports bridging a gap between the second electrical conductor and the electrically-conductive housing, and spaced apart from the first electrical conductor; a contact element moveable between a first position at which the contact element is spaced apart and electrically isolated from the first and second electrical conductors, and a second position at which the contact element contacts the first and second electrical conductors; and an enclosure mounted on the substrate so as to collectively define a hermetically sealed volume; wherein the electrically-conductive housing, the first and second electrical conductors, and the contact element are disposed within the hermetically sealed volume so as to be spaced apart from the enclosure by a gap.