Method for encapsulating an MEMS component

摘要

Method for producing an MST device, and MST device;A method for producing an electromechanical transducer is described, wherein
an MST component is arranged in a container, andthe container is closed with a cover layer, whereinthe cover layer is provided with at least one cutout which divides the cover layer into an inner region and an outer region in such a way that both the inner region and the outer region are connected to the top side—facing the cover layer—of the MST component, andthe inner region is lifted off while the outer region remains adhered.

主权项

1. A method for encapsulating a microsystems technology (MST) component, comprising:
arranging the MST component in a container having an opening, the MST component having a top side that faces the opening, closing the container with a cover layer by adhesively bonding the cover layer to edges of the container and to the top side of the MST component, wherein the top side faces the cover layer, providing the cover layer with at least one cutout closed in a ring-shaped impression which divides the cover layer into an inner region and an outer region in such a way that both the inner region and the outer region keep connected to the top side of the MST component, the at least one cutout being arranged completely over the top side, and laminating a lift-off film onto the cover layer, and lifting off the inner region with the lift-off film while the outer region of the cover layer remains adhered, wherein the at least one cutout extends over the entire layer thickness of the cover layer.