Laser diode stack assembly and method of manufacturing

摘要

A laser diode sub-assembly includes a plurality of laser diode bars, electrically conductive spacers and electrically insulative heat spreaders. The spacers and laser diode bars are arranged by alternating to affix each other via the solder preforms and aligned on the front surfaces, while the back surfaces of the spacers affix the top metalized surfaces of the heat spreaders via the same type of solder preforms. Specially designed fixtures can hold all the components in positions and go through the reflowing. The subassembly can be formed by one heating step. The laser diode stack can be formed by soldering the bottom metalized surfaces of the heat spreaders, via a lower melting temperature solder preform, to a heat sink.

主权项

1. A method of producing a laser diode stack assembly comprising:
providing a plurality of laser diode bars having Anti-Reflective (AR) surfaces and High-Reflective (HR) surface; providing a plurality of electrically conducting spacers, each of the spacers having a uppermost surface and a bottommost surface; forming an interlayered “sandwich” stack by arranging the laser diode bars and the spacers in alternating contact, with each the laser diode bar locating between and in contact with two spacers; providing a plurality of electrically insulative heat spreaders having a width that is approximately a width of the spacers, the width of the spacers being the distance between two side surfaces of the spacers for contacting the laser diode bars; arranging a plurality of the spreader structures such that a gap exists between adjacent ones of the plurality of heat spreader structures; attaching the spreader to the bottommost surfaces of the spacer one on one; forming a laser diode bar subassembly by soldering the laser diode bars, the spacers and the heat spreaders together; providing a heat sink either actively or passively dissipating heat; and forming a laser diode stack by soldering the subassembly on the heat sink.