发明名称 |
Substrate holder system, substrate holder, fastening mechanism, substrate bonding apparatus and method for manufacturing devices |
摘要 |
Provided is a substrate holder system comprising a first substrate holder that holds a first substrate; an engaging member provided on the first substrate holder; a second substrate holder that holds a second substrate and can, together with the first substrate holder, sandwich the first substrate and the second substrate; an engagement receiving member that is provided on the second substrate holder and engages with the engaging member; and a dust restricting means for restricting generation of dust caused by the engagement of the engaging member and the engagement receiving member. |
申请公布号 |
US9054140(B2) |
申请公布日期 |
2015.06.09 |
申请号 |
US201213354570 |
申请日期 |
2012.01.20 |
申请人 |
NIKON CORPORATION |
发明人 |
Sugaya Isao;Chonan Junichi;Maeda Hidehiro |
分类号 |
B29C65/78;H01L21/67;H01L21/18;H01L21/683 |
主分类号 |
B29C65/78 |
代理机构 |
Finnegan, Henderson, Farabow, Garrett & Dunner, LLP |
代理人 |
Finnegan, Henderson, Farabow, Garrett & Dunner, LLP |
主权项 |
1. A substrate holder system comprising:
a first substrate holder including a first surface which holds a first substrate; an engaging member provided on the first substrate holder, the engaging member including a first contact portion; a second substrate holder including a second surface which holds a second substrate and can, together with the first substrate holder, sandwich the first substrate and the second substrate; and an engagement receiving member that is provided on the second substrate holder and engages with the engaging member, the engagement receiving member including a second contact portion; wherein, during engagement of the engaging member and the engagement receiving member, at least one of the first contact portion and second contact portion is below the lower of the first surface and the second surface, the at least one of the first contact portion and second contact portion being within a cavity surrounding the lower of the first contact portion and the second contact portion. |
地址 |
Tokyo JP |