Semiconductor device, imaging device, method of inspecting semiconductor substrate, and method of fabricating semiconductor device

摘要

A semiconductor device includes a first semiconductor substrate and a second semiconductor substrate. The first semiconductor substrate and the second semiconductor substrate are electrically connected to each other in a state in which a first connection surface of the first semiconductor substrate and a second connection surface of the second semiconductor substrate face each other. A concave portion is formed in at least one of the first connection surface and the second connection surface. An electrode, which is electrically connected to a portion of wirings included in a wiring layer provided in the first semiconductor substrate or the second semiconductor substrate in which the concave portion is formed and is capable of being electrically connected to an outside, is formed in an inside of the concave portion.

主权项

1. A semiconductor device comprising:
a first semiconductor substrate having a first wiring layer in which wirings are disposed in a plurality of layers; and a second semiconductor substrate having a second wiring layer in which wirings are disposed in a plurality of layers, wherein in a state in which a first connection surface of the first semiconductor substrate and a second connection surface of the second semiconductor substrate face each other, the first semiconductor substrate and the second semiconductor substrate are electrically connected to each other, a first concave portion is formed in the first connection surface, the first concave portion having a first side surface and a first bottom surface, a first electrode is formed in the first semiconductor substrate, the first electrode being electrically connected to the first wiring layer, the first electrode being exposed at the first bottom surface, and the first concave portion is filled with a filler so as to cover the first side surface and the first bottom surface, the filler being insulating material.