发明名称 Large-scale X-ray detectors
摘要 An X-ray detector including a plurality of chips on a printed circuit board, each of the plurality of chips including a plurality of pixel pads on a center portion of the printed circuit board and a plurality of pin pads surrounding the plurality of pixel pads, a plurality of pixel electrodes on and corresponding to the plurality of chips, a redistribution layer electrically connecting the plurality of pixel electrodes and the plurality of pixel pads, a plurality of first electrode pads on a surface opposite to a surface of the plurality of chips including the plurality of pin pads, a wire electrically connecting the plurality of first electrode pads and the plurality of pin pads, a photoconductor on the plurality of pixel electrodes, and a common electrode on the photoconductor.
申请公布号 US9054010(B2) 申请公布日期 2015.06.09
申请号 US201113212759 申请日期 2011.08.18
申请人 Samsung Electronics Co., Ltd. 发明人 Kim Sang-wook;Kim Chang-jung;Park Jae-chul;Kim Sun-il
分类号 H01L27/146 主分类号 H01L27/146
代理机构 Harness, Dickey & Pierce, P.L.C. 代理人 Harness, Dickey & Pierce, P.L.C.
主权项 1. An X-ray detector, comprising: a plurality of chips each of the plurality of chips including a plurality of pixel pads on an upper surface thereof, a plurality of pin pads surrounding the plurality of pixel pads on the upper surface thereof, and a plurality of first electrode pads on a lower surface thereof to correspond to the plurality of pin pads, each of the plurality of pin pads being electrically connected to a corresponding one of the plurality of pixel pads; a plurality of pixel electrodes on an upper surface of a redistribution layer, the redistribution layer on the upper surface of each of the plurality of chips, at least one of the plurality of pixel electrodes associated with each of the plurality of chips being at least partially between two or more of the plurality of chips; a plurality of second electrode pads on a lower surface of the redistribution layer to correspond to the plurality of pixel pads; a plurality of third electrode pads on the lower surface of the redistribution layer, the plurality of third electrodes electrically connected to the corresponding plurality of pin pads, each of the plurality of third electrode pads having an extension portion extending across an end of at least one of the plurality of chips to correspond with the plurality of first electrodes; and a plurality of wires electrically connecting the extension portion of the plurality of third electrode pads and the corresponding first electrode pad.
地址 Gyeonggi-do KR
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