发明名称 |
HEMT semiconductor device |
摘要 |
In one embodiment, a semiconductor device includes a first semiconductor layer of a first conductivity type or an intrinsic type. The device further includes a second semiconductor layer of the first conductivity type or the intrinsic type disposed above the first semiconductor layer. The device further includes a third semiconductor layer of a second conductivity type including a first upper portion in contact with the first semiconductor layer, a second upper portion located at a lower position than the first upper portion, a first side portion located between the first upper portion and the second upper portion, and a second side portion located at a lower position than the first side portion. |
申请公布号 |
US9054171(B2) |
申请公布日期 |
2015.06.09 |
申请号 |
US201414201641 |
申请日期 |
2014.03.07 |
申请人 |
Kabushiki Kaisha Toshiba |
发明人 |
Ohno Tetsuya;Saito Yasunobu;Fujimoto Hidetoshi;Yoshioka Akira;Uchihara Takeshi;Naka Toshiyuki;Yasumoto Takaaki;Yanase Naoko;Masuko Shingo;Ono Tasuku |
分类号 |
H01L29/66;H01L29/778;H01L29/20;H01L29/06 |
主分类号 |
H01L29/66 |
代理机构 |
White & Case LLP |
代理人 |
White & Case LLP |
主权项 |
1. A HEMT semiconductor device comprising:
a first semiconductor layer of a first conductivity type or an intrinsic type; a second semiconductor layer of the first conductivity type or the intrinsic type disposed above the first semiconductor layer; a control electrode disposed above the second semiconductor layer; and third semiconductor layers of a second conductivity type, each of which includes a first upper portion in contact with the first semiconductor layer, a second upper portion located at a lower position than the first upper portion, a first side portion located between the first upper portion and the second upper portion, and a second side portion located at a lower position than the first side portion, wherein the control electrode is placed immediately above one of the third semiconductor layers, an area of a region surrounded by the second side portion in a vicinity of the second upper portion is twice or more times as large as an area of a region surrounded by the first side portion in a vicinity of the second upper portion, and a level of the first upper portion of the one of the third semiconductor layers placed immediately below the control electrode is lower than a level of the first upper portion of other third semiconductor layers placed other than immediately below the control electrode. |
地址 |
Tokyo JP |