| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that has a low profile, can suppress breaking of wires, and is encapsulated by a transparent resin.SOLUTION: In a semiconductor device, a wire 30 has: a first bonding section 31 bonded with an electrode pad; a second bonding section 33 bonded with a connection terminal 21; and a loop section 32 connected with the first bonding section 31, and in which a folded part is formed in an opposite direction to the second bonding section. Gaps S are respectively provided between the loop section 32 and the first bonding section 31, and between the loop section 32 and the other part of the wire 30. A semiconductor chip 10 is encapsulated by a transparent resin 40 together with the wire 30 and one surface of a circuit board 20. |
