| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper polyimide laminated film in which peeling strength at normal condition and peeling strength after heat treatment are stably improved. ! SOLUTION: A copper polyimide laminated film is formed such that on a polyimide film, a seed layer 1 comprising alloy of nickel and chromium, a barrier layer, a seed layer 2 comprising alloy of nickel and chromium, and a copper layer are formed in this order by vacuum thin film method, and a copper layer is further put thereon by plating method. ! COPYRIGHT: (C)2015,JPO&INPIT |
