发明名称 COPPER BASE FILM-FORMING METHOD
摘要 Provided is a method for easily forming a high quality copper film which has a low decomposition temperature in supercritical fluid and which incurs less deterioration due to the mixing of C and O. The method for forming a copper-based film on a base of supercritical fluid is as follows: by dissolving copper dimer in a supercritical fluid (N,N′-diisopropylpropionamidinate) and depositing copper on a base.
申请公布号 KR20150062938(A) 申请公布日期 2015.06.08
申请号 KR20140154255 申请日期 2014.11.07
申请人 GAS-PHASE GROWTH LTD. 发明人 KONDOH EIICHI;MACHIDA HIDEAKI;ISHIKAWA MASATO;SUDOH HIROSHI
分类号 C23C18/16;C23C18/31 主分类号 C23C18/16
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