| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface treatment liquid and a method for gold or gold alloy plating that effectively prevent an underlaying metal or a material metal from being corroded from a pinhole generated on a gold or gold alloy plating film.SOLUTION: A surface treatment liquid containing a disulfide compound is brought into contact with a gold or gold alloy plating film. A compound represented by following formula (2) is preferable as the disulfide compound: XOS-R-S-S-R-SOX(2) (where Rand Rare each independently a linear or branched alkylene group having 1-10 carbon atoms, a cyclic alkylene group having 3-10 carbon atoms, or a phenylene group, and Rand Rmay be substituted by one or more substituents selected from an alkyl group, a halogen atom, a hydroxyl group, and an alkoxy group; and Xand Xeach represent a monovalent cation). |
