MULTILAYERED ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF AND BOARD HAVING THE SAME MOUNTED THEREON

摘要

The present invention relates to a multilayered electronic component, a manufacturing method thereof and a mounting board thereof. More particularly, the present invention relates to a multilayered electronic component which has a superior current overlapping property by using a metal magnetic material, a low current resistance (Rdc) by increasing the thickness of an internal coil, improves the core loss of the metal magnetic material, obtains high magnetic permeability, and improves efficiency, a manufacturing method thereof and a mounting board thereof.