| 摘要 |
PROBLEM TO BE SOLVED: To more simply perform modification treatment of both sides of a treated object while suppressing size increase of a device.SOLUTION: A plasma processing device includes: a discharge electrode arranged so that its longitudinal direction becomes parallel to a treated object and perpendicular to a conveyance path of the treated object; a counter electrode arranged at a position interposing the treated object with respect to the discharge electrode while facing the discharge electrode parallel thereto; a first adjustment roller which adjusts a contact amount between the treated object conveyed through between the discharge electrode and the counter electrode, and the discharge electrode; a second adjustment roller which adjusts a contact amount between the treated object conveyed through between the discharge electrode and the counter electrode, and the counter electrode; and a control part which controls the contact amount between the treated object and the discharge electrode, and the contact amount between the treated object and the counter electrode, respectively, by controlling the first adjustment roller and the second adjustment roller. |
