发明名称 ETCHING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an etching method in which variations of an etching amount can be minimized. ! SOLUTION: An etching method includes: an object holding step of immersing an object 1 having a flat etching surface 1a into a container 2 holding an etchant 3; a stirring step of stirring the etchant 3 by repeatedly tilting the container 2 to one side and the other side of a fulcrum, with one point of the container 2, when viewed from above, as the fulcrum, within a range where the object 1 is not exposed from the etchant 3; and a rotating step of rotating the object 1 in an outer circumferential direction of an etching surface 1a. ! COPYRIGHT: (C)2015,JPO&INPIT
申请公布号 JP2015106571(A) 申请公布日期 2015.06.08
申请号 JP20130246314 申请日期 2013.11.28
申请人 KYOCERA CORP 发明人 KAWAGUCHI YOSHIYUKI
分类号 H01L21/306 主分类号 H01L21/306
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