发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND PRINTED WIRING BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide a technique capable of suppressing generation of development residues in a hole part such as a through hole, in a solder resist composition containing titanium oxide.SOLUTION: There is provided a photosensitive resin composition containing (A) a carboxyl group-containing resin, (B) an epoxy-based thermosetting component, (C) an inorganic filler, and (D) a photopolymerization initiator. The equivalent of epoxy groups contained in the epoxy-based thermosetting component (B) per equivalent of carboxyl groups contained in the carboxyl group-containing resin (A) is 1.0 or less. The inorganic filler (C) contains titanium oxide. There are also provided a dry film using the photosensitive resin composition and a cured product thereof. |
申请公布号 |
JP2015106118(A) |
申请公布日期 |
2015.06.08 |
申请号 |
JP20130249062 |
申请日期 |
2013.12.02 |
申请人 |
TAIYO INK MFG LTD |
发明人 |
HARIMA EIJI;MITANI TAKESHI;KONDO SHINOBU;FUKUDA SHINICHIRO;KATO KENJI |
分类号 |
G03F7/004;C08F8/14;C08F212/08;C08F220/06;C08F220/10;C08K3/22;C08L63/00;C08L101/08;H05K3/28 |
主分类号 |
G03F7/004 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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