| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a laminated substrate in which some through holes in the substrate are closed reliably, while thinning the plating thickness on the surface of the substrate, and to provide a laminated circuit.SOLUTION: In a method of manufacturing a laminated substrate, a large diameter non-through hole 34 is formed in one surface 22 of a first substrate 14, and a small diameter hole 36 having a diameter smaller than that of the large diameter hole 34 is formed to communicate therewith on the other surface 24 of the first substrate 14. By plating the first substrate 14, the large diameter hole 34 is not closed but the small diameter hole 36 is closed, and a second substrate 16 is laminated on the other surface 24 of the first substrate 14. |
