| 摘要 |
The present invention relates to a photosensitive resin composition, which has good processes and chemical resistance and is allowed to accurately form hole patterns, comprising 1) an alkali-soluble binder resin, 2) poly functional monomers, 3) photo initiators, 4) coloring agents, 5) solvents, and 6) anti-oxidant agents with compounds represented by chemical formula 1. |
